JPH0225563U - - Google Patents
Info
- Publication number
- JPH0225563U JPH0225563U JP10241888U JP10241888U JPH0225563U JP H0225563 U JPH0225563 U JP H0225563U JP 10241888 U JP10241888 U JP 10241888U JP 10241888 U JP10241888 U JP 10241888U JP H0225563 U JPH0225563 U JP H0225563U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- target
- metal layer
- supporting
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10241888U JPH0225563U (en]) | 1988-08-03 | 1988-08-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10241888U JPH0225563U (en]) | 1988-08-03 | 1988-08-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0225563U true JPH0225563U (en]) | 1990-02-20 |
Family
ID=31332312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10241888U Pending JPH0225563U (en]) | 1988-08-03 | 1988-08-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0225563U (en]) |
-
1988
- 1988-08-03 JP JP10241888U patent/JPH0225563U/ja active Pending